《电子电路大全(PDF格式)》第155章

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3。10。3 芯片封装与引脚功能·································································································· （253　）
3。10。4 内部结构与工作原理·································································································· （255　）
3。10。5 应用电路设计·············································································································· （256　）
3。11 915MHz　OOK　收发器模块RD0300　的原理与应用电路设计················································· （259　）
3。11。1 概述······························································································································　（259　）
3。11。2 主要性能指标·············································································································· （259　）
3。11。3 内部结构与引脚功能··································································································· （259　）
3。11。4 模块内部电路·············································································································· （262　）
第4　章 无线通信射频前端芯片的原理与应用电路设计·············································　（265　）
4。1 蓝牙无线收发器芯片SiW1701　的原理与应用电路设计··········································································· （265　）
4。1。1 概述·······························································································································　（265　）
4。1。2 主要技术指标················································································································ （265　）
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4。1。3 芯片封装与引脚功能···································································································· （267　）
4。1。4 内部结构与工作原理···································································································· （270　）
4。1。5 应用电路设计················································································································ （271　）
4。2 900MHz　无绳电话射频前端芯片MAX2420/　21/22/60/63　的原理与应用电路设计················ （273　）
4。2。1 概述·······························································································································　（273　）
4。2。2 主要性能指标················································································································ （273　）
4。2。3 芯片封装与引脚功能···································································································· （274　）
4。2。4 内部结构与工作原理···································································································· （275　）
4。2。5 应用电路设计················································································································ （275　）
4。3 全球定位系统GPS　接收机射频芯片MAX2740　的原理与应用电路设计·····························?