《电子电路大全(PDF格式)》第154章

3。6。5 应用电路设计················································································································ （222　）
3。7 433/868/915MHz　FSK/ASK/OOK　收发器芯片RF2945　的原理与应用电路设计····················· （225　）
3。7。1 概述·······························································································································　（225　）
3。7。2 主要技术指标················································································································ （225　）
3。7。3 芯片封装与引脚功能···································································································· （226　）
3。7。4 内部结构与工作原理···································································································· （229　）
3。7。5 应用电路设计················································································································ （229　）
3。7。6 电路设计实例················································································································ （232　）
3。8 315　/　433　/　868/　915　MHz　FSK　内嵌8051　微控制器的收发器芯片CC1010　的原理与应用电路设计····· （235　）
3。8。1 概述·······························································································································　（235　）
3。8。2 主要性能指标················································································································ （235　）
3。8。3 芯片封装及引脚功能···································································································· （236　）
3。8。4 内部结构与工作原理···································································································· （238　）
3。8。5 应用电路设计················································································································ （239　）
3。9 315。00　MHz　OOK　收发器模块DR3101　的原理与应用电路设计············································· （245　）
3。9。1 概述·······························································································································　（245　）
3。9。2 主要技术指标················································································································ （245　）
3。9。3 芯片封装及引脚功能···································································································· （245　）
3。9。4 内部结构及工作原理···································································································· （248　）
3。9。5 应用电路设计················································································································ （251　）
3。10 2。4GHz　DSSS　收发器芯片组RFW302　原理与应用电路设计················································ （252　）
3。10。1 概述····························································································································· （252　）
3。10。2 主要技术指标··················································································