《电子电路大全(PDF格式)》第152章

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2。7 300MHz～450MHz　ASK　接收器芯片U3745BM　的原理与应用电路设计······························ （136）
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2。7。1 概述·······························································································································　（136）
2。7。2 主要性能指标················································································································ （136）
2。7。3 芯片封装与引脚功能···································································································· （137）
2。7。4 内部结构与工作原理···································································································· （137）
2。7。5 应用电路设计················································································································ （144）
第3　章 射频收发器芯片原理与应用电路设计·································································　（153）
3。1 300MHz～500MHz　无线收发芯片MICRF501　的原理与应用电路设计·································· （153）
3。1。1 概述·······························································································································　（153）
3。1。2 主要性能指标················································································································ （153）
3。1。3 芯片封装与引脚功能···································································································· （154）
3。1。4 内部结构与工作原理···································································································· （155）
3。1。5 应用电路设计················································································································ （156）
3。2 300MHz～930MHz　FSK/FM/ASK　收发器芯片 TH7120　的原理与应用电路设计·················· （168）
3。2。1 概述·······························································································································　（168）
3。2。2 主要技术指标················································································································ （169）
3。2。3 芯片封装与引脚功能···································································································· （169）
3。2。4 内部结构与工作原理···································································································· （170）
3。2。5 应用电路设计················································································································ （175）
3。3 OOK/ASK　868。35　MHz　收发器芯片TR1001　的原理与应用电路设计···································· （182）
3。3。1 概述·······························································································································　（182）
3。3。2 主要技术指标················································································································ （183）
3。3。3 芯片封装及引脚功能···························